Overview Solidot in CIIF 2024

From September 24 to 28, 2024, the China International Industrial Expo (hereinafter referred to as the "CIIE") grandly took place at the National Exhibition and Convention Center (Shanghai). As the largest and most influential comprehensive industrial event in the country, this year's CIIE was themed "Intelligent and Connected – Empowering New Industrial Development," showcasing the latest technologies, products, and cutting-edge innovations in the industrial field.

At this year's CIIE, Solidot presented its theme of "Technology First, Innovation at Its Core," relying on the solid achievements obtained through continuous innovation and research and development. They carefully prepared a series of powerful bus I/O products for a grand debut.

Strong Interference Resistance, No Dropouts – Slice I/O XB6S

The XB6S series is the latest generation of Slice I/O modules developed and upgraded by Solidot. This product features exceptional anti-interference capabilities, allowing it to maintain efficient operation in diverse and complex application scenarios.

On-site, Solidot conducted ESD tests, using an electrostatic gun to simulate static interference on the module. During the demonstration, the XB6S series products showed no dropouts, no lost packets, and no jitter, garnering widespread attention from attendees.

Image: On-site ESD testing

In addition, the XB6S series features separated wiring for the upper and lower parts, with channels corresponding to indicator lights. The terminal area distinguishes between positive and negative power, and includes functions such as automatic diagnostics, alarms, and anomaly logging. These innovative designs further sparked the interest of the audience, leading to multiple trial applications on the spot.

Simplified Design, Adaptive Changes – Distributed I/O XBF

The XBF series is a newly launched distributed I/O module from Solidot, meticulously developed to address the challenges of complex wiring and limited expansion in industrial production. It offers significant advantages such as reduced wiring, diverse forms, flexible topology, and versatile applications.

Based on real-world usage scenarios, a comparison was made between the traditional wiring method inside two electrical cabinets and the wiring method of the XBF, demonstrating the wiring savings achieved by the XBF series. Additionally, the various product types of XBF and its flexible topology were dynamically displayed, meeting customer product needs for dispersed points and long distances.

Exceptional Performance, Precision Control – High-Speed Slice I/O XN6

At this year's CIIE, Solidot unveiled its new high-speed I/O backplane bus technology, with related products like the XN6 now fully in the testing phase. The synchronization performance and motion control demonstration showed the collaborative synchronization and high-precision control capabilities of the XN6 products. The XN6 series is scheduled for official release in 2025.

Industry Customization, Innovative Manufacturing – Diverse Function Modules

Solidot aims to solve specific industry challenges in bus I/O applications, focusing on critical pain points across multiple fields. They have selectively developed function modules for strain gauge measurement, three-phase power measurement, temperature control, and light source control, allowing attendees to appreciate Solidot's innovative research and development capabilities. This also reinforces Solidot's business philosophy of putting customer demand at the core.

Image: Prospective customers at the exhibition

Every impressive appearance at the CIIE is not only a comprehensive examination of the functionality and value of Solidot's products but also a testament to its continuous pursuit of excellence and iterative optimization. In the future, Solidot will remain committed to the development concept of "Technology First, Innovation at Its Core," continuously exploring new heights in the bus I/O field.