Solidot's Spectacular Presence Continues at the Munich Shanghai Electronics Manufacturing Equipment Exhibition.

From March 20 to 22, 2024, the Munich Shanghai Electronics Manufacturing Equipment Exhibition (hereinafter referred to as the Munich Exhibition) was held at the Shanghai New International Expo Centre. At this year's Munich Exhibition, Solidot made a powerful appearance with its advantageous products, continuing the momentum from the successful Guangzhou SPS Exhibition. The rich product range drew increasing attention, significantly boosting foot traffic at the booth.

In addition to the motion control, temperature, and strain acquisition modules that shone at the Guangzhou SPS Exhibition, the valve island series and the new generation of Slice remote I/O - XB6S, which leads the General I/O series, attracted even more attention. Relying on interactive physical displays and customized solutions, the full series of products confidently showcased Solidot's cutting-edge achievements and R&D capabilities to both domestic and international audiences:

• Supports various bus protocols with strong versatility.

• Comprehensive accessories save wiring effort.

• Supports short-circuit/open-circuit diagnosis and single-channel empty-hold functionality.

• The C2S series features output channel counting functionality.

• The C2P series uses RJ45 connectors for ease of use in the field.

• All products can be customized according to client requirements.

↑ Solidot’s new generation Slice I/O - XB6S

High Performance Overview

• Internal bus speed can reach up to 6 Mbps, with I/O cut-off time less than 150 µs and analog sampling frequency ≤ 1 ksps.

• The X-bus backplane bus protocol supports larger data packets of up to 1024 Bytes.

• Smaller communication cycles, with a full-load communication cycle of less than 1.2 ms for 32 modules.

• Coupler scan cycles can be as low as 100 µs, enabling I/O refresh to synchronize with the controller's scan cycle.

Reliable — Stability in Operation Ensured

• The product has passed certifications including CE, UL, RoHS, and REACH.

• Communication redundancy design allows recovery from backplane bus abnormalities.

• Utilizes gold-plated connectors to extend operational lifespan.

• Underwent stringent EMC testing, far exceeding industry standards.

Comprehensive — Full Adaptability and Product Range

• Provides abundant documentation to help users quickly understand the products.

• Received consistency certifications from ETG, PI-China, and supports various protocols.

• Features functional modules for motion control, gateways, pneumatics, temperature control, and more, along with a wide range of related accessories.

User-Friendly — Simple Configuration and Easy Operation

• Equipped with diagnostic functions, alarms, and anomaly logs to assist in rapid fault resolution.

• Features a detachable terminal design that simplifies installation and maintenance.

• Offers upper-level software that supports firmware updates and configuration optimization.

For over a decade, Solidot has continuously leveraged its rich industry experience to provide thousands of professional-grade industrial bus solutions for global markets in the automotive, photovoltaic, new energy, 3C, and medical sectors. In the future, Solidot will continue to explore the potential of its existing technology platforms, continually upgrading and iterating its products, while upholding the principles of innovation, integrity, and openness to provide outstanding service to clients and achieve win-win outcomes!